All-copper Chip-to-substrate Interconnections for Flip-chip Packages
نویسندگان
چکیده
منابع مشابه
Effect Of Underfill On Flip-Chip Solder Bumps: An Experimental Study By Microscopic Moiré Interferometry
Thermo-mechanical deformations of flip-chip interconnections on an organic substrate are investigated by microscopic moiré interferometry. A detailed experimental procedure for microscopic moiré experiments is described and the effect of specimen preparation is discussed. Two identical packages, one with and the other without underfill, are investigated. They are subjected to a uniform thermal ...
متن کاملParametric Design and Reliability Analysis of Wire Interconnect Technology Wafer Level Packaging
The demands for electronic packages with lower profile, lighter weight, and higher input/ output (I/O) density have led to rapid expansion in flip chip, chip scale package (CSP) and wafer level packaging (WLP) technologies. The urgent demand high I/O density and good reliability characteristics have led to the evolution of ultra high-density non-solder interconnection, such as wire interconnect...
متن کاملReliability Evaluation of Underfill Encapsulated Pb- Free Flip Chip Package under Thermal Shock Test
Thermo-mechanical reliability of the solder bumped flip chip packages having underfill encapsulant was evaluated with thermal shock testing. In the initial reaction, the reaction product between the solder and Cu mini bump of chip side was Cu6Sn5 IMC layer, while the two phases which were (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 were formed between the solder and electroless Ni-P layer of the package side. ...
متن کاملDynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages
The work presented in this paper focuses on the behavior of anisotropically conductive film (ACF) joint under the dynamic loading of flip chip on glass (COG) and flip chip on flexible (COF) substrate packages. Impact tests were performed to investigate the key factors that affect the adhesion strength. Scanning electron microscopy (SEM) was used to evaluate the fractography characteristics of t...
متن کاملSingular stress fields at corners in flip-chip packages
An electronic device integrates diverse materials, and inevitably contains sharp features, such as interfaces and corners. When the device is subject to thermal and mechanical loads, the corners develop intense stress and are vulnerable sites to initiate failure. This paper analyzes stress fields at corners in flip-chip packages. The stress at a corner is a linear superposition of two modes of ...
متن کامل